Thermal management system for portable electronic devices

ABSTRACT

A wearable electronic device is disclosed. The device can include a support structure and an electronic component disposed in or on the support structure. A heat exchanger element can be thermally coupled with the electronic component, the heat exchanger element comprising a fluid inlet port and a fluid outlet port. A first conduit can be fluidly connected to the fluid inlet port of the heat exchanger, the first conduit configured to convey, to the heat exchanger, liquid at a first temperature. A second conduit can be fluidly connected to the fluid outlet port of the heat exchanger, the second conduit configured to convey, away from the heat exchanger, liquid at a second temperature different from the first temperature.

PRIORITY CLAIM

This application claims the benefit of priority under 35 U.S.C. § 119(e)of U.S. Provisional Application No. 62/853,613 filed on May 28, 2019.The entire disclosure of each of this priority document is incorporatedherein by reference.

BACKGROUND Field

The field relates to a thermal management system for portable electronicdevices.

Description of the Related Art

In various types of portable electronic devices, it can be challengingto sufficiently dissipate heat that is generated by on-boardelectronics, the power supply (e.g., batteries), or other electroniccomponents that act as heat sources. It can be desirable to improve thedissipation of heat in electronic devices.

For example, in some embodiments, modern computing and displaytechnologies have facilitated the development of systems for virtualreality and/or augmented reality experiences, wherein digitallyreproduced images or portions thereof are presented to a user in amanner wherein they seem to be, or may be perceived to be, real. Avirtual reality, or “VR”, scenario typically involves presentation ofdigital or virtual image information without transparency to otheractual real-world visual input; an augmented reality, or “AR”, scenariotypically involves presentation of digital or virtual image informationas an augmentation to visualization of the actual world around the user.

Some VR or AR systems may include portable electronic devices that maybe subject to the thermal loads that may be uncomfortable to the user orthat may damage the components of the system. Accordingly, there remainsa continuing need for improved thermal solutions for portable (e.g.,wearable) electronic devices, including those used in conjunction withVR or AR systems.

SUMMARY

Various embodiments disclosed herein relate to thermal managementsystems for wearable or portable electronic devices, such as forwearable VR or AR systems. Various types of wearable electronic devicesinclude processors and other components that generate heat. Such heatgeneration can increase the temperature of the electronic device, whichmay generate discomfort for the user, and/or may negatively affect theoperation of the electronic device(s). Various embodiments disclosedherein include a thermal management system that includes a liquidcooling apparatus including liquid conduit(s) and heat exchanger(s)configured to remove heat from the device so as to improve userexperience and/or device operation.

In one embodiment, a wearable electronic device is disclosed. Thewearable electronic device can include a support structure. The wearableelectronic device can include an electronic component disposed in or onthe support structure. The wearable electronic device can include a heatexchanger element thermally coupled with the electronic component, theheat exchanger element comprising a fluid inlet port and a fluid outletport. The wearable electronic device can include a first conduit fluidlyconnected to the fluid inlet port of the heat exchanger, the firstconduit configured to convey, to the heat exchanger, liquid at a firsttemperature. The wearable electronic device can include a second conduitfluidly connected to the fluid outlet port of the heat exchanger, thesecond conduit configured to convey, away from the heat exchanger,liquid at a second temperature different from the first temperature.

In another embodiment, a cooling system for a portable device isdisclosed. The cooling system can include a heat generating element anda heat transfer system. The heat transfer system can include a heatexchanger disposed adjacent to the heat generating element, a radiator,a fan disposed adjacent to the radiator, a heat transfer circuit influid communication with the heat exchanger and the radiator, and a pumpin fluid communication with the heat transfer circuit. The coolingsystem can include a motor having an output shaft coupled with at leastone of the fan and the pump.

Details of one or more implementations of the subject matter describedin this specification are set forth in the accompanying drawings and thedescription below. Other features, aspects, and advantages will becomeapparent from the description, the drawings, and the claims. Neitherthis summary nor the following detailed description purports to defineor limit the scope of the inventive subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 depicts an illustration of an augmented reality scenario withcertain virtual reality objects, and certain physical objects viewed bya person.

FIGS. 2A-2D schematically illustrate examples of a wearable system,according to various embodiments.

FIGS. 3A-3C illustrate a head mounted component and a local processingand data module, according to various embodiments.

FIG. 4 is a schematic system view of a thermal management system,according to one embodiment.

FIG. 5 is a schematic system view of a thermal management system,according to another embodiment.

FIG. 6 is a schematic view of an accumulator shown in FIG. 5 .

FIG. 7 is a schematic system diagram showing a portion of a thermalmanagement system used for filling the system with a cooling liquid,according to various embodiments.

Throughout the drawings, reference numbers may be re-used to indicatecorrespondence between referenced elements. The drawings are provided toillustrate example embodiments described herein and are not intended tolimit the scope of the disclosure.

DETAILED DESCRIPTION

Various embodiments disclosed herein relate to a portable (e.g.,wearable) electronic device. For example, in FIG. 1 an augmented realityscene 4 is depicted wherein a user of an AR technology sees a real-worldpark-like setting 6 featuring people, trees, buildings in thebackground, and a concrete platform 1120. In addition to these items,the user of the AR technology also perceives that he “sees” a robotstatue 1110 standing upon the real-world platform 1120, and acartoon-like avatar character 2 flying by which seems to be apersonification of a bumble bee, even though these elements 2, 1110 donot exist in the real world. At least the elements 2, 1110 can beprovided to the user at least in part by the portable (e.g., wearable)electronic devices disclosed herein. As it turns out, the human visualperception system is very complex, and producing a VR or AR technologythat facilitates a comfortable, natural-feeling, rich presentation ofvirtual image elements amongst other virtual or real-world imageryelements is challenging.

For instance, head-worn AR displays (or helmet-mounted displays, orsmart glasses) typically are at least loosely coupled to a user’s head,and thus move when the user’s head moves. If the user’s head motions aredetected by the display system, the data being displayed can be updatedto take the change in head pose into account.

As an example, if a user wearing a head-worn display views a virtualrepresentation of a three-dimensional (3D) object on the display andwalks around the area where the 3D object appears, that 3D object can bere-rendered for each viewpoint, giving the user the perception that heor she is walking around an object that occupies real space. If thehead-worn display is used to present multiple objects within a virtualspace (for instance, a rich virtual world), measurements of head pose(e.g., the location and orientation of the user’s head) can be used tore-render the scene to match the user’s dynamically changing headlocation and orientation and provide an increased sense of immersion inthe virtual space.

In AR systems, detection or calculation of head pose can facilitate thedisplay system to render virtual objects such that they appear to occupya space in the real world in a manner that makes sense to the user. Inaddition, detection of the position and/or orientation of a real object,such as handheld device (which also may be referred to as a “totem”),haptic device, or other real physical object, in relation to the user’shead or AR system may also facilitate the display system in presentingdisplay information to the user to enable the user to interact withcertain aspects of the AR system efficiently. As the user’s head movesaround in the real world, the virtual objects may be re-rendered as afunction of head pose, such that the virtual objects appear to remainstable relative to the real world. At least for AR applications,placement of virtual objects in spatial relation to physical objects(e.g., presented to appear spatially proximate a physical object in two-or three-dimensions) may be a non-trivial problem. For example, headmovement may significantly complicate placement of virtual objects in aview of an ambient environment. Such is true whether the view iscaptured as an image of the ambient environment and then projected ordisplayed to the end user, or whether the end user perceives the view ofthe ambient environment directly. For instance, head movement willlikely cause a field of view of the end user to change, which willlikely require an update to where various virtual objects are displayedin the field of the view of the end user. Additionally, head movementsmay occur within a large variety of ranges and speeds. Head movementspeed may vary not only between different head movements, but within oracross the range of a single head movement. For instance, head movementspeed may initially increase (e.g., linearly or not) from a startingpoint, and may decrease as an ending point is reached, obtaining amaximum speed somewhere between the starting and ending points of thehead movement. Rapid head movements may even exceed the ability of theparticular display or projection technology to render images that appearuniform and/or as smooth motion to the end user.

Head tracking accuracy and latency (e.g., the elapsed time between whenthe user moves his or her head and the time when the image gets updatedand displayed to the user) have been challenges for VR and AR systems.Especially for display systems that fill a substantial portion of theuser’s visual field with virtual elements, it is advantageous if theaccuracy of head-tracking is high and that the overall system latency isvery low from the first detection of head motion to the updating of thelight that is delivered by the display to the user’s visual system. Ifthe latency is high, the system can create a mismatch between the user’svestibular and visual sensory systems, and generate a user perceptionscenario that can lead to motion sickness or simulator sickness. If thesystem latency is high, the apparent location of virtual objects willappear unstable during rapid head motions.

In addition to head-worn display systems, other display systems canbenefit from accurate and low latency head pose detection. These includehead-tracked display systems in which the display is not worn on theuser’s body, but is, e.g., mounted on a wall or other surface. Thehead-tracked display acts like a window onto a scene, and as a usermoves his head relative to the “window” the scene is re-rendered tomatch the user’s changing viewpoint. Other systems include a head-wornprojection system, in which a head-worn display projects light onto thereal world.

Additionally, in order to provide a realistic augmented realityexperience, AR systems may be designed to be interactive with the user.For example, multiple users may play a ball game with a virtual balland/or other virtual objects. One user may “catch” the virtual ball, andthrow the ball back to another user. In another embodiment, a first usermay be provided with a totem (e.g., a real bat communicatively coupledto the AR system) to hit the virtual ball. In other embodiments, avirtual user interface may be presented to the AR user to allow the userto select one of many options. The user may use totems, haptic devices,wearable components, or simply touch the virtual screen to interact withthe system.

Detecting head pose and orientation of the user, and detecting aphysical location of real objects in space enable the AR system todisplay virtual content in an effective and enjoyable manner. However,although these capabilities are key to an AR system, but are difficultto achieve. In other words, the AR system can recognize a physicallocation of a real object (e.g., user’s head, totem, haptic device,wearable component, user’s hand, etc.) and correlate the physicalcoordinates of the real object to virtual coordinates corresponding toone or more virtual objects being displayed to the user. This generallyrequires highly accurate sensors and sensor recognition systems thattrack a position and orientation of one or more objects at rapid rates.Current approaches do not perform localization at satisfactory speed orprecision standards.

Thus, there is a need for a better localization system in the context ofAR and VR devices. Moreover, the continual and/or rapid movement ofusers can introduce various other problems into the electrical, thermal,and/or mechanical systems of such AR and/ VR devices. In addition, theuse of processor(s) and other heat generation components may beuncomfortable to the user, or may otherwise reduce the performance ofthe system. For example, the processor(s) and other heat source(s) maybe located in a headset near the skin of the user, which may generatediscomfort for the user during operation of the system. Accordingly, itcan be important to provide improved thermal management systems for ARand VR devices.

Referring to FIGS. 2A-2D, some general componentry options areillustrated. In the portions of the detailed description which followthe discussion of FIGS. 2A-2D, various systems, subsystems, andcomponents are presented for addressing the objectives of providing ahigh-quality, comfortably-perceived display system for human VR and/orAR.

As shown in FIG. 2A, an AR system user 60 is depicted wearing headmounted component 58 featuring a frame 64 structure coupled to a displaysystem 62 positioned in front of the eyes of the user. A speaker 66 iscoupled to the frame 64 in the depicted configuration and positionedadjacent the ear canal of the user (in one embodiment, another speaker,not shown, is positioned adjacent the other ear canal of the user toprovide for stereo / shapeable sound control). The display 62 isoperatively coupled 68, such as by a wired lead or wirelessconnectivity, to a local processing and data module 70 which may bemounted in a variety of configurations, such as fixedly attached to theframe 64, fixedly attached to a helmet or hat 80 as shown in theembodiment of FIG. 2B, embedded in headphones, removably attached to thetorso 82 of the user 60 in a backpack-style configuration as shown inthe embodiment of FIG. 2C, or removably attached to the hip 84 of theuser 60 in a belt-coupling style configuration as shown in theembodiment of FIG. 2D.

The local processing and data module 70 may comprise a power-efficientprocessor or controller, as well as digital memory, such as flashmemory, both of which may be utilized to assist in the processing,caching, and storage of data a) captured from sensors which may beoperatively coupled to the frame 64, such as image capture devices (suchas cameras), microphones, inertial measurement units, accelerometers,compasses, GPS units, radio devices, and/or gyros; and/or b) acquiredand/or processed using the remote processing module 72 and/or remotedata repository 74, possibly for passage to the display 62 after suchprocessing or retrieval. The local processing and data module 70 may beoperatively coupled 76, 78, such as via a wired or wirelesscommunication links, to the remote processing module 72 and remote datarepository 74 such that these remote modules 72, 74 are operativelycoupled to each other and available as resources to the local processingand data module 70.

In one embodiment, the remote processing module 72 may comprise one ormore relatively powerful processors or controllers configured to analyzeand process data and/or image information. In one embodiment, the remotedata repository 74 may comprise a relatively large-scale digital datastorage facility, which may be available through the internet or othernetworking configuration in a “cloud” resource configuration. In oneembodiment, all data is stored and all computation is performed in thelocal processing and data module, allowing fully autonomous use from anyremote modules.

FIGS. 3A and 3B illustrates one embodiment of a head mounted component58A and a local processing and data module 70. FIG. 3A also illustratesa handheld controller 71 configured to manipulate the system during anAR or VR experience. FIG. 3C is a schematic perspective sectional viewof the component 58A shown in FIG. 3B. Unless otherwise noted, featuresof FIG. 3A may be the same as or generally similar to like-numberedcomponents of FIGS. 1-2D. The devices shown in FIGS. 3A-3B illustratethe Magic Leap One system sold by Magic Leap, Inc., of Plantation,Florida. However, the embodiments disclosed herein can be used with anytype of portable (e.g., wearable) electronic device. The frame 64A ofthe head mounted component 58A may be part of a support structure 101.The support structure 101 may comprise one or more cavities 59 therein.Various types of electronic components, power supplies, and otherdevices may be mounted on or within the support structure 101, forexample, within the one or more cavities 59. As explained herein, thesedevices on or within the support structure 101 may generate heat, e.g.,may act as heat sources. The heat generated by these devices may beuncomfortable for the user, or may otherwise negatively affect thesystem’s operation. Accordingly, there remains a continuing need forimproved heat dissipation techniques for the head mounted component 58A.Similarly, in various embodiments, the electronic components of thelocal processing and data module 70 may generate heat, which may beuncomfortable for the user or may otherwise affect the operation of thesystem. The embodiments disclosed herein can accordingly be used toimprove thermal dissipation in the head mounted component 58A, the localprocessing and data module 70, or both. Indeed, the embodimentsdisclosed herein can be used for any suitable type of portable (e.g.,wearable) electronic device.

Examples of Thermal Management Systems

FIG. 4 is a schematic system view of a thermal management system 100,according to one embodiment. The thermal management system 100 can bedisposed in or on the support structure 101 of the head mountedcomponent 58 or 58A. For example, in some embodiments, the thermalmanagement system 100 can be disposed in the one or more cavities 59 ofthe enclosure 101. In other embodiments, the thermal management system100 can be disposed in or on the local processing and data module 70, inor on the handheld controller 71, and/or on any other suitable type ofportable (e.g., wearable) electronic device. As explained above, variousheat sources (such as electronic components 102 a, 102 b) may bedisposed in or on the support structure 101, e.g., within the one ormore cavities 59. The electronic components 102 a, 102 b generate heat,which may make the user uncomfortable or otherwise negatively affectsystem performance. The electronic components 102 a, 102 b can be anytype of component or device that generates heat. For example, theelectronic components 102 a, 102 b can comprise processor(s), opticalemitters (e.g., light emitting diodes, or LEDs), a projector, a powersupply, or any other type of component that generates heat. Although twoelectronic components 102 a, 102 b are shown in FIG. 4 , it should beappreciated that any number of electronic components may be coupled withthe support structure 101.

To convey heat away from the electronic components 102 a, 102 b, theelectronic components 102 a, 102 b can be thermally coupled withcorresponding first and second heat exchanger elements 103 a, 103 b. Forexample, the electronic component 102 a can be thermally attached to thefirst heat exchanger element 103 a by way of a thermal conductive mediasuch as a thermal adhesive (e.g., a thermal interface material, or TIM).The electronic component 102 b can be thermally attached to the secondheat exchanger element 103 b by way of a thermal conductive media (suchas a TIM). The first and second heat exchangers 103 a, 103 b can includecavity structures or chambers configured to transfer heat from theelectronic components 102 a, 102 b to a liquid cooling system thatconveys the heat away from the electronic components 102 a, 102 b andthe heat exchangers 103 a, 103 b. For example, in various embodiments,the first and second heat exchangers 103 a, 103 b can include internalgeometry such as winding channels, cavities, or pins configured toincrease or maximize the area of heat transfer between fluids.

As shown in FIG. 4 , the first and second heat exchangers 103 a, 103 bcan be in fluid communication with a collection radiator 106 that isconfigured to dissipate the thermal energy collected by the heatexchangers 103 a, 103 b to the outside environs (e.g., ambient air). Insome embodiments, the collection radiator 106 can be positioned on thesupport structure 101 so as to be located at or near the back side ofthe user’s head when worn. A first conduit 104 a can fluidly connect afirst fluid inlet port 105 a of the first heat exchanger 103 a to acorresponding first port 114 a of the collection radiator 106. Theconduits 104 a, 104 b may be disposed in or on the enclosure 101, e.g.,within the one or more cavities 59 in some embodiments. In otherembodiments, the conduits 104 a, 104 b may be at least partially exposedto the outside environs. A second conduit 104 b can fluidly connect afirst fluid outlet port 105 b of the first heat exchanger 103 a to acorresponding second port 114 b of the collection radiator 106. A thirdconduit 104 c can fluidly connect a first fluid inlet port 105 c of thesecond heat exchanger 103 b to a corresponding third port 114 c of thecollection radiator 106. A fourth conduit 104 d can fluidly connect afirst fluid outlet port 105 d of the second heat exchanger 103 b to acorresponding fourth port 114 d of the collection radiator 106.

The collection radiator 106 can comprise internal pipes or conduitsconfigured to transfer heat collected from the first and second heatexchanger elements 103 a, 103 b to the outside environs, e.g., air. Forexample, the collection radiator 106 can comprise a plurality of pins orfins 115 that increase the surface area exposed to air to therebyimprove heat dissipation to the outside environs (for example, by way ofopenings within the support structure 101). The collection radiator 106can also include a fill port 107 a and a vent 107 b. the collectionradiator 106 can be filled with a cooling fluid or coolant by supplyingthe cooling fluid to the fill port 107 a. The vent 107 b (which cancomprise a one-way vent in some embodiments) can be configured to allowair to escape from the collection radiator 106 during filling. After theradiator 106 is filled with the cooling fluid, the fill port 107 a andvent 107 b can be sealed or otherwise closed. As explained below inconnection with FIGS. 5-6 , an accumulator can also be provided alongthe fluid pathway of the system to prevent gases or bubbles from formingin the cooling liquid. In some embodiments, a fan 116 may be provided toaccelerate the airflow over the fins 115 to improve heat dissipationaway from the collection radiator 106. In various embodiments, the fan116 may be provided in or on the enclosure 101, e.g., within the one ormore cavities 59. In some embodiments, air can flow into the cavities 59through an intake port and can convey heat away from the componentsthrough an outlet port. In other embodiments, no fan may be provided inthe thermal management system 100. In some embodiments, the collectionradiator 106 or a portion thereof (e.g., fins 115 of the radiator 106)can be oriented away from the body of the user (e.g., away from theuser’s head) so that heat can be transferred away from the user. Invarious embodiments, the fins 115 can be exposed to ambient air toenhance cooling. In some embodiments, the portion of the thermalmanagement system opposite the fins 115, such as support block 119, canbe selected so as to insulate the user’s body from heat collected by theradiator 106.

Moreover, as explained and illustrated below in connection with FIG. 6 ,a pump and a motor that drives the pump may also be provided (not shownin FIG. 4 ). The motor can be activated by suitable electronics to drivethe pump, which in turn can drive the liquid through the conduits104a-104d and the heat exchanger elements 103 a, 103 b. In someembodiments, an output shaft of the motor can be coupled with the fan116 and the pump to simultaneously rotate the fan 116 to generateairflow over the radiator 106 and the pump to flow a liquid through theheat exchanger(s) 103 a or 103 b and the radiator 106. In someembodiments, a clutching mechanism or switching mechanism can beprovided such that the system can separately drive the fan 116 and thepump when the fan 116 and the pump share a common motor shaft and motor.In some embodiments, the fan 116 and the pump may each have anassociated motor for separately driving the fan 116 and pump. Further,in some embodiments, the radiator 106 can comprise an active coolingsink, such as active or forced air flow over extended surface areas(e.g., fins or pins).

The thermal management system 100 shown in FIG. 4 is an example of abalanced thermal system. For example, as shown in FIG. 4 , a firstthermal pathway 117 a (e.g., including the conduits 104 a, 104 b) canconvey heat from the first heat exchanger element 103 a to thecollection radiator 106. A second thermal pathway 117 b (e.g., includingthe conduits 104 c, 104 d) can convey heat from the second heatexchanger element 103 b to the collection radiator 106. In FIG. 4 , thefirst and second thermal pathways 117 a, 117 b are at least partiallyand in some cases completely thermally independent or isolated from oneanother. The pathway 117 b can be independent of the pathway 117 a atleast between the radiator 106 and the heat exchanger elements withwhich they are coupled respectively. This can provide advantages ofallowing the amount of heat to be removed from each electronic component102 a, 102 b to be independently addressed. For example, in FIG. 4 , theamount of heat collected by the first heat exchanger element 103 a andtransferred to the radiator 106 may be independent from the amount ofheat collected by the second heat exchanger element 103 b andtransferred to the radiator 106.

During operation, a pump (not shown in FIG. 4 , see FIG. 5 ) can driveliquid (e.g., a coolant) in the thermal management system 100 along thefirst conduit 104 a to the first heat exchanger element 103 a by way ofthe first fluid inlet 105 a. The liquid can be routed within the firstheat exchanger element 103 a to the second conduit 104 b by way of thefirst fluid outlet 105 a (and any additional conduits or tubing withinthe first heat exchanger element 103 a. Thus, cool or cold liquid can besupplied at a first temperature to the first heat exchanger element 103a along the first conduit 104 a. The heat generated by the electroniccomponent 102 a (which can act as a heat source) can increase thetemperature of the liquid to a second temperature that is greater thanthe first temperature. It should be appreciated that although the heatsource of FIG. 4 includes an electronic component 102 a, in otherembodiments, the heat source can comprise any other suitable device orsystem that generates unwanted thermal energy. The resulting warm or hotliquid at the second temperature can be conveyed away from the firstheat exchanger element 103 a to the collection radiator 106 along thesecond conduit 104 b. The cooling liquid can comprise any suitable typeof coolant, including, e.g., a solution comprising water and propyleneglycol. The pump in the thermal management system 100 can be integratedeither physically or functionally into the collection radiator 106. Forexample the pump can be housed in the support block 119 in oneembodiment or can be separately housed as is illustrated in connectionwith the system 200 discussed below.

Similarly, the pump (or another pump) discussed above can drive liquid(e.g., a coolant) along the third conduit 104 c to the second heatexchanger element 103 b by way of the fluid inlet 105 c of the secondheat exchanger element 103 b. The liquid can be routed within the secondheat exchanger element 103 b to the fourth conduit 104 d by way of thefluid outlet 105 d (and any additional conduits or tubing within thesecond heat exchanger element 103 b. Thus, cool or cold liquid can besupplied at a first temperature to the second heat exchanger element 103b along the third conduit 104 c. The heat generated by the electroniccomponent 102 b (which can act as a heat source) can increase thetemperature of the liquid to a second temperature that is greater thanthe first temperature. The resulting warm or hot liquid at the secondtemperature can be conveyed away from the second heat exchanger element103 b to the collection radiator 106 along the fourth conduit 104 d.

The warm or hot liquid at the second temperature(s) may pass through oneor more conduits in the collection radiator 106. Thermal energy from thewarm or hot liquid can be transferred to the fins 115 of the radiator106, and from the fins 115 to air. As explained above, in someembodiments, the fan 116 can enhance the dissipation of heat from thefins 115 by accelerating the airflow over the fins 115.

Beneficially, the thermal management system 100 shown in FIG. 4 canreduce the temperature substantially so as to maintain user comfort andsystem performance. For example, the thermal management system 100 canmaintain the surface temperature of the head mounted component 58, 58Aat a level below a predetermined maximum temperature threshold. In someembodiments, the surface temperature of the head mounted component 58,58A can be maintained at a temperature of at least 10° C. less than thepredetermined maximum temperature threshold. In some embodiments, thesurface temperature of the head mounted component 58, 58A can bemaintained at a temperature of at least 12° C. less than thepredetermined maximum temperature threshold. In some embodiments, thesurface temperature of the head mounted component 58, 58A can bemaintained at a temperature of at least 18° C. less than thepredetermined maximum temperature threshold, for example, when thesystem 100 includes a fan to improve heat dissipation. Accordingly, invarious embodiments, the surface temperature of the head mountedcomponent 58, 58A can be maintained at a temperature in a range of 10°C. to 25° C. less than the predetermined maximum threshold temperature.In some embodiments, the thermal management system 100 can reduce thetemperature to slightly above ambient temperature, e.g., to atemperature of 1° C. to 5° C. above ambient temperature (e.g., roomtemperature). In various embodiments, the thermal management system 100can be configured to dissipate thermal energy approximately equal to thethermal energy produced by the heat-generating components (such as thecomponents 102 a, 102 b), such that the thermal loop is close to orapproximately energy-neutral.

Moreover, the thermal management system 100 can advantageously beprovided in a small form factor suitable for use in a portable (e.g.,wearable) electronic device.

FIG. 5 is a schematic system view of a thermal management system 200,according to another embodiment. Unless otherwise noted, the componentsof FIG. 5 may be generally similar to or the same as like numberedcomponents of FIG. 4 , with the reference numerals incremented by 100relative to the reference numerals of FIG. 4 . For example, as with FIG.4 , the thermal management system 200 of FIG. 5 can comprise a liquidcooling system configured to transfer thermal energy away from heatsources, such as electronic components 202 a, 202 b. Unlike theembodiment of FIG. 4 , however, which illustrated a balanced thermalsystem, the embodiment of FIG. 5 illustrates an unbalanced thermalsystem.

As shown in FIG. 5 , the first and second thermal pathways 217 a, 217 bmay not be independent or isolated from one another. Rather, as shown inFIG. 5 , the thermal pathways 217 a, 217 b may be in series with oneanother such that some thermal energy collected from the first heatexchanger element 203 a can be transferred to the second heat exchangerelement 203 b by way of the second thermal pathway 217 b. Likewise, somethermal energy from the second heat exchanger element 203 b can betransferred back to the first heat exchanger element 203 a by the secondthermal pathway 217 b. Beneficially, in various embodiments, theunbalanced system 200 shown in FIG. 5 may be preferable in situations inwhich the thermal loads are not symmetric. In the unbalanced system 200of FIG. 5 , for example, the cooler liquid can be routed to the heatexchanger 203 a coupled to the larger heat load first, and then to thesecond heat exchanger 203 b before being transferred to the radiator206. By contrast, for balanced loads in which the thermal loads of eachheat source (e.g., each component 102a/202a, 102b/202b) areapproximately the same, it may be desirable to utilize the balancedsystem 100 of FIG. 4 .

The system 200 shown in FIG. 5 can include a pump 209 driven by a motor218. The pump 209 can comprise any suitable type of pump, such as aregenerative pump. In other embodiments, a piezoelectric pump or acentrifugal pump can be used. The motor 218 can comprise any suitabletype of motor. In some embodiments, for example, the motor 218 cancomprise a pancake motor, which can be relatively thin so as to fitwithin the small form factor of the support structure 101. In someembodiments, an output shaft of the motor 218 can be coupled with thefan 216 and the pump 209 to simultaneously rotate the fan 216 togenerate airflow over the radiator 206 and the pump 209 to flow a liquidthrough the heat exchanger(s) 203 a or 203 b and the radiator 206. Insome embodiments, a clutching mechanism or switching mechanism can beprovided such that the system can separately drive the fan 216 and thepump 209 when the fan 216 and the pump 209 share a common motor shaftand motor 218. In some embodiments, the fan 216 and the pump 209 mayeach have an associated motor for separately driving the fan 216 andpump 209. The pump 209 can drive the liquid to an accumulator 208configured to regulate the pressure of the cooling liquid to maintainthe appropriate liquid volume and to avoid air pockets created by liquidevaporation during the thermal cycles. As explained in FIG. 6 below, theaccumulator 208 can control (e.g., reduce or eliminate) the amount ofair that results from evaporation of the coolant liquid. For example, asexplained below, a pressure regulator or other device can be used tocompress the liquid to avoid any air gaps or voids that are created dueto evaporation.

The liquid (which may be relatively warm or hot) can be transferred tothe collection radiator 206. Thermal energy from the liquid can bedissipated to the environment by way of the fins 215. In variousembodiments, internal structures (e.g., baffles) within the radiator 206can further increase the surface area to improve heat dissipation. Asexplained above, in some embodiments, the fan 216 can be used toaccelerate the airflow to improve heat dissipation. In otherembodiments, no fan may be provided. As with FIG. 4 , the fill port 207a and the vent 207 b can be provided. Once the heat is dissipated by thecollection radiator 206, the relatively cool liquid can be transferredalong the first conduit 204 a to a first fluid inlet 205 a of the firstheat exchanger element 203 a. At least some thermal energy from theelectronic component 202 a can be transferred to the cooling liquid fromthe first heat exchanger element 203 a so as to increase the temperatureof the liquid. The liquid can then be conveyed along the third conduit204 c to the second heat exchanger element 203 b. The liquid within thethird conduit 204 c that is conveyed away from the first heat exchanger203 a may be warmer than the liquid conveyed to the heat exchanger 203 aalong the first conduit 204 a, but the increase in temperature may berelatively small such that the liquid entering the second heat exchangerelement 203 b from the third conduit 204 c is relatively cool.

Thermal energy from the electronic component 202 b can be transferred tothe liquid, e.g., to increase the temperature of the liquid. The liquidpassing within the second heat exchanger element 203 b from the thirdconduit 204 c can exit the second heat exchanger from a fluid outletport and can enter a fifth conduit 204 e that loops back into a fluidinlet port of the second heat exchanger element 203 b. The liquid can beconveyed away from the second heat exchanger element 203 b by way of thefourth conduit 204 d. The liquid in the fourth conduit may be warmerthan the liquid conveyed to the second heat exchanger element 203 b bythe third conduit 204 c, in view of the thermal energy transferred tothe liquid by the second heat exchanger element 203 b. The liquid canre-enter the first heat exchanger element 203 a from the second thermalpathway 217 b. Thermal energy from the electronic component 202 a andthe first heat exchanger element 203 a can further increase thetemperature of the liquid. The resulting warm or hot liquid can beconveyed back to the collection radiator 206 by the second conduit 204b. The hot liquid can be at least partially cooled by the radiator 206before passing through the pump 209 and accumulator 208. The liquid canbe additionally cooled by the radiator 206 after passing through thepump 209 and accumulator 208.

In some embodiments, the electronic component(s) 202 a may be generatemore heat (or may be hotter than) the electronic component(s) 202 b.Thermally coupling the hotter component 202 a to the first upstream heatexchanger element 203 a can improve heat dissipation, since more thermalenergy can be removed by the first heat exchanger element 203 a than bythe second heat exchanger element 203 b, which may enable the system 200to cool both the first and second components 202 a, 202 b in aneffective manner. Similarly, if the VR or AR device is configured toselect which electronic component 202 a or 202 b is to be used, or isconfigured to select relative processing loads for the electroniccomponents 202 a, 202 b, then the system 200 can be configured to applya higher processing load on the component 202 a than the component 202b, since thermal energy may be dissipated more efficiently by the firstheat exchanger element 203 a than by the second heat exchanger element203 b. In some embodiments, the first upstream heat exchanger element203 a can be made smaller than (or can be made to remove less heat than)the second heat exchanger element 203 b, so that each heat exchangerelement 203 a, 203 b can be configured to remove approximately the sameamount of thermal energy (or a predetermined relative amount of thermalenergy). In other embodiments, the heat exchanger elements 203 a, 203 bcan have approximately the same thermal dissipation capabilities orsizes.

FIG. 6 is a schematic view of the accumulator 208 of FIG. 5 . Althoughshown in FIG. 6 , the accumulator 208 can also be used in conjunctionwith the system 100 shown in FIG. 4 . When the thermal managementsystems 100 or 200 are disposed in the support structure 101 of a headmounted component 58, 58A, the user may move such that bubbles may bedisplaced from the liquid. Moreover, the heating of the liquid insidethe systems 100 or 200 may lead to evaporation and further displacementof air or gas. It can be desirable to limit or control (e.g., prevent)the amount of air that passes through the system 100 or 200.

The accumulator 208 of FIG. 6 can include a pressure chamber 210 throughwhich the liquid is conveyed from the pump 209. A cap 212 can beslidably engaged with the pressure chamber 210 by way of a spring 211 orother deformable element. The accumulator 208 can comprise a valve 213,such as a one-way vent or valve, that allows air into the accumulator208 but does not allow air to escape. As the liquid evaporates, or asair or gas is otherwise displaced from the liquid, air from the outsideenvirons enters the valve 213 to compress the liquid and air with thecap 212 to compensate for any voids or gaps that result from evaporationor movement. In various embodiments, the amount of evaporation of liquidcan be measured so as to predict when the device 208 should be serviced.

FIG. 7 is a schematic system diagram showing a portion of a thermalmanagement system 300 used for filling the system 300 with a coolingliquid, according to various embodiments. Unless otherwise noted, thecomponents of FIG. 7 may be generally similar to or the same as likenumbered components of FIG. 5 , with the reference numerals incrementedby 100 relative to the reference numerals of FIG. 5 . For example, aswith FIG. 5 , the system 300 can include an accumulator 308 that caninclude a reservoir and a pressure chamber, a pump 309, and a radiator306. A first valve V1 can selectively control the flow of liquid to theaccumulator 308. A second valve V2 can selectively control the flow ofliquid to the pump 309. A third valve V3 can selectively control theflow of liquid between the accumulator 308 and the pump 309.

In various embodiments, the thermal management system 300 (and/or thesystem 100, 200) can be filled with a cooling liquid by placing thefirst and second valve V1, V2 in an open configuration and by placingthe third valve V3 in a closed configuration. Coolant liquid can besupplied through the second valve V2 and into the pump 309 by way of afill port (similar to fill port 107 a, 207 a). A vent (similar to vent107 b, 207 b) can be submerged in an open reservoir filled with coolant.The pressure of the coolant liquid being supplied to the system 300 canforce air out through the vent. The third valve V3 can be opened toallow liquid to pass between the accumulator 308 and the pump 309, andadditional coolant liquid can be added as desired. To test the system300, the first and second valves V1, V2 can be closed, and the pump 309can be activated to run the system 300. If air bubbles are observed, orif the pump 309 experiences cavitation, then additional liquid can besupplied as explained herein.

Additional Considerations

Any processes, methods, and algorithms described herein and/or depictedin the attached figures may be embodied in, and fully or partiallyautomated by, code modules executed by one or more physical computingsystems, hardware computer processors, application-specific circuitry,and/or electronic hardware configured to execute specific and particularcomputer instructions. For example, computing systems can includegeneral purpose computers (e.g., servers) programmed with specificcomputer instructions or special purpose computers, special purposecircuitry, and so forth. A code module may be compiled and linked intoan executable program, installed in a dynamic link library, or may bewritten in an interpreted programming language. In some implementations,particular operations and methods may be performed by circuitry that isspecific to a given function.

Further, certain implementations of the functionality of the presentdisclosure are sufficiently mathematically, computationally, ortechnically complex that application-specific hardware or one or morephysical computing devices (utilizing appropriate specialized executableinstructions) may be necessary to perform the functionality, forexample, due to the volume or complexity of the calculations involved orto provide results substantially in real-time. For example, a video mayinclude many frames, with each frame having millions of pixels, andspecifically programmed computer hardware is necessary to process thevideo data to provide a desired image processing task or application ina commercially reasonable amount of time.

Code modules or any type of data may be stored on any type ofnon-transitory computer-readable medium, such as physical computerstorage including hard drives, solid state memory, random access memory(RAM), read only memory (ROM), optical disc, volatile or non-volatilestorage, combinations of the same and/or the like. The methods andmodules (or data) may also be transmitted as generated data signals(e.g., as part of a carrier wave or other analog or digital propagatedsignal) on a variety of computer-readable transmission mediums,including wireless-based and wired/cable-based mediums, and may take avariety of forms (e.g., as part of a single or multiplexed analogsignal, or as multiple discrete digital packets or frames). The resultsof the disclosed processes or process steps may be stored, persistentlyor otherwise, in any type of non-transitory, tangible computer storageor may be communicated via a computer-readable transmission medium.

Any processes, blocks, states, steps, or functionalities in flowdiagrams described herein and/or depicted in the attached igures shouldbe understood as potentially representing code modules, segments, orportions of code which include one or more executable instructions forimplementing specific functions (e.g., logical or arithmetical) or stepsin the process. The various processes, blocks, states, steps, orfunctionalities can be combined, rearranged, added to, deleted from,modified, or otherwise changed from the illustrative examples providedherein. In some embodiments, additional or different computing systemsor code modules may perform some or all of the functionalities describedherein. The methods and processes described herein are also not limitedto any particular sequence, and the blocks, steps, or states relatingthereto can be performed in other sequences that are appropriate, forexample, in serial, in parallel, or in some other manner. Tasks orevents may be added to or removed from the disclosed exampleembodiments. Moreover, the separation of various system components inthe implementations described herein is for illustrative purposes andshould not be understood as requiring such separation in allimplementations. It should be understood that the described programcomponents, methods, and systems can generally be integrated together ina single computer product or packaged into multiple computer products.Many implementation variations are possible.

The processes, methods, and systems may be implemented in a network (ordistributed) computing environment. Network environments includeenterprise-wide computer networks, intranets, local area networks (LAN),wide area networks (WAN), personal area networks (PAN), cloud computingnetworks, crowd-sourced computing networks, the Internet, and the WorldWide Web. The network may be a wired or a wireless network or any othertype of communication network.

The invention includes methods that may be performed using the subjectdevices. The methods may comprise the act of providing such a suitabledevice. Such provision may be performed by the end user. In other words,the “providing” act merely requires the end user obtain, access,approach, position, set-up, activate, power-up or otherwise act toprovide the requisite device in the subject method. Methods recitedherein may be carried out in any order of the recited events which islogically possible, as well as in the recited order of events.

The systems and methods of the disclosure each have several innovativeaspects, no single one of which is solely responsible or required forthe desirable attributes disclosed herein. The various features andprocesses described above may be used independently of one another, ormay be combined in various ways. All possible combinations andsubcombinations are intended to fall within the scope of thisdisclosure. Various modifications to the implementations described inthis disclosure may be readily apparent to those skilled in the art, andthe generic principles defined herein may be applied to otherimplementations without departing from the spirit or scope of thisdisclosure. Thus, the claims are not intended to be limited to theimplementations shown herein, but are to be accorded the widest scopeconsistent with this disclosure, the principles and the novel featuresdisclosed herein.

Certain features that are described in this specification in the contextof separate implementations also can be implemented in combination in asingle implementation. Conversely, various features that are describedin the context of a single implementation also can be implemented inmultiple implementations separately or in any suitable subcombination.Moreover, although features may be described above as acting in certaincombinations and even initially claimed as such, one or more featuresfrom a claimed combination can in some cases be excised from thecombination, and the claimed combination may be directed to asubcombination or variation of a subcombination. No single feature orgroup of features is necessary or indispensable to each and everyembodiment.

Conditional language used herein, such as, among others, “can,” “could,”“might,” “may,” “e.g.,” and the like, unless specifically statedotherwise, or otherwise understood within the context as used, isgenerally intended to convey that certain embodiments include, whileother embodiments do not include, certain features, elements and/orsteps. Thus, such conditional language is not generally intended toimply that features, elements and/or steps are in any way required forone or more embodiments or that one or more embodiments necessarilyinclude logic for deciding, with or without author input or prompting,whether these features, elements and/or steps are included or are to beperformed in any particular embodiment. The terms “comprising,”“including,” “having,” and the like are synonymous and are usedinclusively, in an open-ended fashion, and do not exclude additionalelements, features, acts, operations, and so forth. Also, the term “or”is used in its inclusive sense (and not in its exclusive sense) so thatwhen used, for example, to connect a list of elements, the term “or”means one, some, or all of the elements in the list. In addition, thearticles “a,” “an,” and “the” as used in this application and theappended claims are to be construed to mean “one or more” or “at leastone” unless specified otherwise. Except as specifically defined herein,all technical and scientific terms used herein are to be given as broada commonly understood meaning as possible while maintaining claimvalidity.

As used herein, a phrase referring to “at least one of” a list of itemsrefers to any combination of those items, including single members. Asan example, “at least one of: A, B, or C” is intended to cover: A, B, C,A and B, A and C, B and C, and A, B, and C. Conjunctive language such asthe phrase “at least one of X, Y and Z,” unless specifically statedotherwise, is otherwise understood with the context as used in generalto convey that an item, term, etc. may be at least one of X, Y or Z.Thus, such conjunctive language is not generally intended to imply thatcertain embodiments require at least one of X, at least one of Y and atleast one of Z to each be present.

Similarly, while operations may be depicted in the drawings in aparticular order, it is to be recognized that such operations need notbe performed in the particular order shown or in sequential order, orthat all illustrated operations be performed, to achieve desirableresults. Further, the drawings may schematically depict one more exampleprocesses in the form of a flowchart. However, other operations that arenot depicted can be incorporated in the example methods and processesthat are schematically illustrated. For example, one or more additionaloperations can be performed before, after, simultaneously, or betweenany of the illustrated operations. Additionally, the operations may berearranged or reordered in other implementations. In certaincircumstances, multitasking and parallel processing may be advantageous.Moreover, the separation of various system components in theimplementations described above should not be understood as requiringsuch separation in all implementations, and it should be understood thatthe described program components and systems can generally be integratedtogether in a single software product or packaged into multiple softwareproducts. Additionally, other implementations are within the scope ofthe following claims. In some cases, the actions recited in the claimscan be performed in a different order and still achieve desirableresults.

1-20. (canceled)
 21. A cooling system for a portable device, comprising:a heat generating element; a heat transfer system, comprising: a heatexchanger disposed adjacent to the heat generating element; a radiator;a fan disposed adjacent to the radiator; a heat transfer circuit influid communication with the heat exchanger and the radiator; and a pumpin fluid communication with the heat transfer circuit; and a motorhaving an output shaft coupled with at least one of the fan and thepump.
 22. The cooling system of claim 21, wherein the output shaft ofthe motor is coupled with the fan and the pump to simultaneously rotatethe fan to generate airflow over the radiator and the pump to flow aliquid through the heat exchanger and the radiator.
 23. The coolingsystem of claim 22, wherein the liquid includes water and propyleneglycol.
 24. The cooling system of claim 21, wherein the pump includes aregenerative pump.
 25. The cooling system of claim 21, wherein the pumpincludes a piezoelectric pump.
 26. The cooling system of claim 21,wherein the pump includes a centrifugal pump.
 27. The cooling system ofclaim 21, wherein the motor comprises a pancake motor.